Sarcon GR-Fd thermal interface gap filler pad is a unique gel-like material. It is manufactured with an integrated nylon mesh layer that prevents distortion and stretching during die-cut operations.
The GORE SFP+ copper cable assemblies offer a more reliable, efficient, and economical alternative to fiber optic modules for transmitting 10 Gbps data at distances up to 25 meters.
A line of XRF tools is introduced for compliance testing and monitoring of prohibitive metals for the EU directives RoHS/WEEE for the circuit board and packaging electronics and plating industries.
More than 10,000 DC-DC solutions in the lower power range (below 60 Watts) are offered. The parts are pin compatible with many popular designs to offer a high-quality drop-in replacement solution for engineers.
The multifunctional NSG 3040 test system generates electrical fast transient (EFT), surge, and power quality tests (PQT) and is fully compliant to the latest versions of IEC/EN 61000-4-4, -4-5, and -4-11, making the system ideal for use in CE mark testing. The system can generate EFT tests to 4.
Fully shrouded post headers, available in two through 12 positions, have been added to the popular Economy Power (EP) connector family. Intended for secondary power circuit applications, the through-hole headers have a current-carrying capacity of 7.5 A maximum per contact.
Visual aesthetics are a key feature for the RoHS compliant Series 14 range of raised and flush mount pushbuttons, indicators, switches, selector switches, and key switches. Series 14 is available in 22.5 and 30.
The Rhodeus offers mid-range computing power in a compact, low power consumption, and low cost PC/104 single board computer. It is an excellent choice for low cost/high volume applications with mid-range performance requirements, such as medical equipment and instrumentation.
The Bal Conn contact, which consists of a canted-coil spring retained in a metal housing, ensures uniform, reliable mechanical and electrical contact between the battery and lead in implantable devices.
This stackable multilayer capacitor series features a significantly reduced footprint, increasing printed circuit board space. Offering high capacitance values with low ESR, the TurboCap MLCs (patent pending) are designed to handle high ripple current at high frequencies and high power levels.
Outsourcing using concurrent engineering practices provides the hands-on approach for a company that enables it to gain the most in efficiencies from manufacturing. It can be used by virtually any company of any size and applied to any medical device, product, or component.
In the medical device industry, designers continue to face unique challenges that stem from the broader manufacturing process. These can include anything from shorter product lifecycles and increased regulatory scrutiny to the need to source materials from a myriad of suppliers across the value chain.
By Randy Flamm Medical device manufacturers operate in one of the world’s most competitive and highly regulated industries where success hinges on time-to-market and traceability.
By Kevin Duggan Medical device companies have achieved significant improvement using lean techniques. Improvements in quality, productivity, lead time, inventory, on-time delivery, and cost have been obtained and further improvement continues each day.
The Project: Create a handle for a defibrillator durable enough to withstand exceptional performance requirements. The Solution: Use computer-aided engineering and various flow simulation software to ensure that the final product met the specific characteristics necessary for success.