Copper foam, now available from Goodfellow, combines the
outstanding thermal conductivity of copper with the structural benefits of a
metal foam. These features are of particular interest to design engineers
working in the fields of medical products and devices, defense systems and
manned flight, power generation, and the manufacture of semiconductor devices.
It is a true skeletal structure – not a sintered, coated, or
plated product – and its purity is typically that of the parent alloy metal,
with no voids, inclusions or entrapments. The matrix of cells and ligaments is
completely repeatable, regular and uniform throughout the material, yielding a
rigid, highly porous and permeable structure with a controlled density of metal
per unit volume.
Characteristics of copper foam include:
- Optimal heat transfer
- High strength-to-weight ratio
- High surface area-to-volume ratio
- Isotropic load response
- Controlled stress-strain characteristics
- Can be brazed
- Can be coated and plated
Copper foam is available from Goodfellow in standard pore
sizes of 5, 10, 20 and 40 pores per inch, with a density range of 3 to 12%.
However, the foam can be compressed to achieve higher densities (up to about
70%) and smaller pore sizes (as high as approximately 500 pores per inch).
For more information about copper foam, call Goodfellow at
1-800-821-2870, email info@goodfellowusa.com
or go to “New Products” in the News section of www.goodfellowusa.com.