Nextreme Thermal Solutions, the leader in micro-scale
thermal management and power generation solutions, today announced that its
thin-film thermoelectric technology has achieved a 60.1°C temperature
difference between its cold and hot sides at an ambient temperature of 24.7°C,
bringing it on par with the performance of bulk thermoelectric technology. The
60°C temperature milestone, known as the Tmax, reflects the ability of the
thermoelectric device to pump heat efficiently.This new level of performance
translates to improved cooling efficiency, lower input power requirements, and
greater opportunities for solving thermal issues in electronics, photonics,
automotive, avionics, and high-speed PCR applications.
The electronic industry's continued trend of smaller form
factors, greater circuit density, and highly integrated packaging has
translated into significant thermal problems for electronics-related
manufacturers. As a result of this technology achievement, Nextreme can now
bring its thermal management solutions to additional, substantial markets that
require not only the current advantages of its products, but also the
performance provided by this new capability. This provides Nextreme the
opportunity for significant business growth over time.
The improved performance is the result of new materials
development at Nextreme and the use of advanced, state-of-the-art interconnect
and contact technology developed at the Center for Solid State Energetics at
RTI International.
"Our thin-film technology has now achieved the
performance level of standard bulk thermoelectrics," said Dave Koester,
vice president of engineering at Nextreme. "Achieving a 60°C ?T at room
temperature raises the bar for improved efficiencies and lower operating costs
for our customers while opening up new markets for Nextreme."
Nextreme will be introducing new products with this higher
level of cooling performance in 2012.
Nextreme Thermal Solutions Inc.
919-597-7300; www.nextreme.com