Mill-Max’s organic fibre plug (OFP®) solder barrier receptacles
are discrete sockets for through-hole soldering into printed circuit boards.
These open bottom receptacles are fitted with
organic fibre plugs to prevent solder, paste or flux from contaminating the
internal contact during the placing and soldering process. When the
device/mating lead is plugged into the receptacle the OFP® is knocked out
allowing the mating lead to pass through the fingers of the internal contact
and make a reliable electrical connection.
14 sizes/styles are now available, 13 have standard tape
& reel packaging. The advantage of tape & reel packaging for these
receptacles is it permits through-hole components to be placed simultaneously
with surface mount parts on pick-’n-place assembly lines – eliminating the need
to hand place the receptacles in an additional manufacturing step. The OFP®
barrier permits the sockets to be vacuum picked from the tape prior to
placement in a hole in the circuit board.
The knock-out-bottom feature enables these sockets to be
made relatively short compared to many similar receptacles. The reduced length
provides two advantages: the receptacles can stand upright and stable in a
carrier tape pocket and the protrusion through the PCB is minimal — especially
important when working with SMT boards. The
open bottom receptacle design eliminates the need to trim long device leads
that would otherwise bottom out in a closed receptacle design and also makes
them ideal for low profile board stacking applications via the ability to pass
through.
The OFP® parts are available as discrete receptacles and,
and can be supplied in bulk or on carrier tape per EIA-481 for industry
standard pick and place machines.
All Mill-Max receptacles use a precision-machined brass
housing with a press-fit beryllium copper “multi-finger” contact.
Intrusive reflow (also called "pin-in-paste") is a
technique of using conventional through-hole components in a reflow soldering
process. The receptacles are placed into
plated-through holes (PTH) in the circuit board (solder paste has previously
been screen printed on pads adjacent to the holes) and the board is reflowed in
the same pass as other SMT components. Solder will fill the PTH and achieve
solder joints as reliable as wave soldering. The OFP® barrier prevents solder
paste from being picked-up inside the contact during pick ‘n place assembly.
"Overprinting" paste on the solder mask can be used to adjust the
volume of paste required to fill each hole.)
Mill-Max
516-922-6000; www.mill-max.com/PR626