Interplex Engineered Products, a turnkey, vertically
integrated world-class supplier of stamped, plated and molded precision
components and a division of Interplex Industries, Inc., has introduced a new patent-pending
Surface Mount Technology (SMT) Card-Edge Connector System based on the
company’s press-fit technology.
Interplex’s new product is a discreet pick and place SMT
component that creates a solderless edge card interconnection for daughter
board applications. Theses SMT Card-Edge contacts can be placed on a daughter
card using standard high-speed pick and place surface mount equipment. The Surface
Mount Device (SMD) solder interface utilizes pin in paste through-hole
technology as well as recessed channels for improved solder distribution which
allows for high mechanical strength at the point of connection.
Joe Lynch, Interplex’s Director of Advanced Product
Development commented, “We continue to expand our press-fit technology to meet
the ever evolving needs of our customers. As new applications emerge, Interplex
will search for new ways to solve challenging problems by eliminating
unnecessary processes and providing the most robust interconnect solution.
The SMT Card Edge Contact System is designed for standard
1.6 mm (0.062”) thick printed circuit boards (PCB’s) but is compatible with
additional PCB thicknesses. The center minimum PCB spacing is 3.2 mm (0.126”).
The product features Interplex’s proven and tested 0.64 mm
press-fit technology. It is packaged in a 16 mm x 4 mm pitch EIA tape on a 13”
diameter plastic reel for compatibility to standard high-speed surface mount
pick-and-place equipment. It is suitable for high-conductivity material, able
to carry up to 15 amps per contact.
Interplex Engineered Products
www.interplex.com/card-edge