The Compact IEC 60309 High Power Connection Devices are configured with 3 or 5 pins; with either a 4, 6 or 9 hour earth pin position; inlets and outlets can be angled or panel mounted. Plugs and connectors can be cable mounted, and are IP44 or IP67 rated for dust and splashing water.
The HMC874LC3C, HMC875LC3C, and HMC876LC3C are SiGe monolithic, 20 Gbps clocked comparators that feature high speed latches with programmable hysteresis and reduced swing PECL/CML/ECL output drivers respectively.
The NXT-400 compact (3.9" × 8" × 1.5") AC/DC power supplies, which pack 400 W of power into an 8.5 W/cubic inch power density, fit easily into 1 U high OEM applications or any application where space is critical.
IsoSphere AR Coated Ball Lenses are durable, evenly-coated antireflection ball lenses in diameters from 200 microns to 10 mm, created using the company's proprietary IsoDyn low pressure chemical vapor deposition process.
ETRX3 ZigBee Module features the EM357 and EM351the latest ARM Cortex M-3 SOCs from Ember. The modules have a footprint of just 19 × 25 mm for both standard and PA/LNA versions. They are available with either an on-board antennae or a Hirose U.
The Air Jets air nozzles are designed to deliver a concentrated flow of air or liquid to a designated location. Featuring a unique ball nozzle design, the Air Jet line is available with a wide range of nozzles, bases, and mounting hardware.
The NF25 diaphragm pump can handle liquid and gas-liquid mixtures at a flow rate up to 250 ml/min in
The 1020-M Ultra Light-Weld is an ultra-fast, tack-free, LED-curable adhesive. It's designed for rapid bonding of a wide variety of plastics typically used in the manufacture of medical devices, such as reservoirs, tube sets, port fittings, drug delivery systems, and heat-sensitive applications.
TThe high-speed ATCA backplane offers up to triple the performance of traditional versions at a reduced cost by using Z-plane Links, which carry high-speed signals with long traces via a small PCB board that plugs directly into the rear of the backplane.
The drive towards mobility and miniaturization of medical electronics is a goal of many of today's device manufacturers. However, each of them is attempting to miniaturize at different levels.
The push for miniaturization in medical devices is very apparent to manufacturers in all sectors of the industry. However, this trend is closely coupled with the goal of also making these smaller devices portable.
Advances in materials are always exciting and significantly contribute to innovations in medical device technology. In the orthopedic arena, one company has developed a technique with which to enhance the material properties of polyethylene for hip and knee replacements. By Aiguo Wang, Ph.D.
Millipore Corp. has created an online MAb (monoclonal antibody) Bioprocess Sizing Tool to help biomanufacturing scientists and engineers develop and design filtration and chromatography processes.
IDES Inc. offers a previously recorded webinar to assist design engineers with selecting plastic materials for their next product application.
ITW Formex has published the 5th Edition of its engineering design and specification guide that provides practical information to engineers, designers, and technical staff specifying electrical insulation and flame retardant materials.