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May 2011 Digital Edition

Sun, 05/01/2011 - 12:00am

Inside: Read about microelectronics packaging technology evolution accommodating to increasing demands for lightweight and smaller size modules in “Innovative Microelectronics Packaging for In-Vitro Implantable Devices,” from Crane Aerospace & Electronics. Shared are professionals’ opinions on device designs, molding, and cardiovascular. Additionally, read about quiet DC motors, GE healthcare scan, strategic outsourcing, and optimizing power. Check out the selection of products, as well as the offerings for engineers in Design notes.

Click here to read the May 2011 issue

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