STROMBOLI can convert input voltages up to 400V into multiple, symmetrical if required, output voltages up to +/-25V. The galvanic isolation between input an outputs is at least 10MΩ at 500V.
The STROMBOLI technology includes an Application Note, a Reference Design and a demonstration board with the related datasheet, schematics, and bill-of-material (BOM). The demonstration board is available in two versions, optimized for input voltage ranges of 15-40V or 150-350V. They both provide a symmetrical output at +/-12V and can deliver 25W with efficiencies up to 70% at 225°C.
Besides these examples, STROMBOLI technology can be used to build isolated dc-dc converters delivering up to 150W output power. The input voltage range can be adapted to cover the 540V input voltage requirement of Industrial applications and the level of isolation can be brought as high as the 2.5KV required for some Aeronautics applications.
The STROMBOLI design is based on the fly-back architecture making the technology highly flexible and scalable, easily adaptable by customers depending on their needs. For high output powers, a synchronous rectification is implemented for an improved efficiency while for low power levels, standard rectification can simplify the BOM. A magnetic feedback provides the output voltage temperature stability and the load regulation. STROMBOLI features CISSOID’s chip-set MAGMA & HYPERION and high temperature transistors from the PLANET family. STROMBOLI also features an Under-Voltage-Lockout (UVLO) function and the pulse-by-pulse current sensing provides intrinsic output current limitation in case of overload or short-circuits.
With STROMBOLI CISSOID further extends its VOLCANO family of dc-dc converters that operate reliably under extreme temperature. While ETNA, VESUVIO and EREBUS target point-of-load applications, STROMBOLI provides galvanic isolation and symmetrical outputs, together with an extended range if input voltages.
STROMBOLI technology is available immediately for licensing. The reference design and its active BOM can be mapped onto high temperature substrates and assembled in high reliability modules.