UMC, Elpida, Powertech team up on 3D IC
This 3D chip is based on through-silicon via (TSV) technology and uses UMC`s 28-nanometer process, whose volume production is scheduled for 2012.
The chip is used in consumer electronics as mobile phones and digital cameras.
UMC CEO S.W. Sun pointed out that Elpida launched eight gigabyte DRAM using TSV technology last year, while his company completed 28nm logic tapeout, with Powertech skilled at stack-type packaging technology.
UMC`s executives says it will work with Elpida on front-end process of TSV 3D chip technology in Japan, make the chip using its 28nm process, with Powertech to handle chip packaging.
Elpida`s executives say that the foremost advantage of TSV is to build sheer number of input-output connections between logic and DRAM devices, boost data transmission and reduce power consumption, adding that to materialize these advantages calls for working with a reliable foundry.