In question here is the use of oxide bonding for backside illumination in CMOS image sensors (CIS) , if such oxide surfaces are treated with plasma and/or other chemicals and if the Ziptronix patent claims pertaining to these processes are valid.

A recent market study by Yole Développement  [see “2010CMOS Image Sensors Technologies & Markets -2010”] has reported that most of the CIS manufacturers have moved, or are moving, to back side imaging (BSI) technology.

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