Advertisement
News
Advertisement

Chip-to-Wafer direct-metallic-bonding technology developed at Leti used in customized 300mm device bonder

Tue, 02/22/2011 - 8:36pm
I-Micronews

CEA-Leti today announced a multi-partner project to demonstrate high-alignment-accuracy (<1µm) chip-to-wafer structures made by direct metallic bonding. Such structures are required for high-performance 3D integrated circuits and could enable a wide range of applications in microelectronics as well as in optoelectronics or MEMS.

SOURCE

Advertisement

Share this Story

X
You may login with either your assigned username or your e-mail address.
The password field is case sensitive.
Loading