STATS ChipPAC launches enhanced Flip Chip packaging with fcCuBE? Technology
STATS ChipPAC Ltd. (“STATS ChipPAC” or the “Company” – SGX-ST: STATSChP), a leading semiconductor test and advanced packaging service provider, today launched the innovative fcCuBE™ technology, an advanced flip chip packaging technology that features copper (Cu) column bumps, Bond-on-Lead (BOL) interconnection and Enhanced assembly processes. fcCuBE technology delivers high input/output (I/O) density, high performance and superior reliability in advanced silicon nodes. The fcCuBE technology offers enhanced flip chip packaging with a 20-40% lower cost over standard flip chip packaging, a compelling value with price points comparable to mainstream semiconductor packaging solutions.
As semiconductor devices are scaled to advanced wafer technology nodes of 45/40nm and below, innovations in package structure, design and assembly process are key to achieving high performance, cost-effective product solutions. fcCuBE technology addresses a complex set of packaging challenges and delivers important benefits including: