Thermal Conductive Epoxy
Master Bond EP21AO is a two component, thermally conductive, electrically isolating epoxy adhesive with a forgiving 1 to 1 mix ratio by weight or volume. This compound is extremely versatile and will adhere well to a variety of similar and dissimilar substrates. It has a low coefficient of expansion, low shrinkage, and superb dimensional stability. It also exhibits superior durability and chemical resistance. EP21AO is easy to apply and is a self leveling paste. It is 100% reactive and does not contain any solvents or volatiles.