A high-performance, electrically conductive, B-staged film adhesive is capable of bonding to gold or gold-plated substrates. E2213F is suited for EMI/RF grounding applications and meets ASTMD 3850 for space simulated outgassing and MIL STD 883 section 188.8.131.52 for TGA outgassing. It is available as a preform or in sheet form up to 12 in. square. The company is a leading manufacturer of epoxy adhesive films and preforms. The epoxies are B-staged thermoplastic or thermosetting materials that are available both supported and unsupported. Other materials utilized include epoxy/urethane, thermoplastic polyester, and polyimide thermosetting resins.