Room Temperature Curing Adhesive
EP33 is a unique room temperature curing epoxy adhesive for high temperature bonding applications. This two component epoxy offers the convenience of a room temperature cure with high temperature performance combined with good physical strength and dielectric properties. It produces high strength bonds exceeding 220 Kg/cm² (3,100 psi) in shear and maintains this impressive strength even after exposure to temperatures in the 205 to 235°C (400 to 450°F) range. Curing can be accomplished at room temperature or in as little as one hour at 95°C.