High-Performance Gel Provides Low Thermal Resistance
Revitalized interest in high performance interface gel compounds has prompted a re-manufacture and restock of the once discontinued product—Sarcon XR-e material. The advanced silicone-based TIM provides a thermal conductivity of 11 W/m-k with an extremely low thermal resistance that ranges from 0.11 to 0.35 °Cin2/W depending on material thickness. The gel is specifically engineered to remove high levels of unwanted heat from components such as CPUs and semiconductors by making complete, low resistance contact between the heat source and nearby heat sinks. This material also complies with UL 94 V-O flame retardancy specifications.