Placement and Inspection Capabilities for Miniaturized Medical Devices
With medical device OEMs requiring smaller, lighter, and longer lasting devices, Suntron Corporation, a leader in integrated electronics manufacturing systems (EMS) and embedded computing solutions, announces that it has the capability to place and inspect the tiny packages needed for miniaturized medical device electronics.
Suntron builds highly complex boards with 01005 components requiring the control of many variables during assembly process. The 01005 case size is half the size of the 0201, previously considered to be the smallest case size in Surface Mount Technology. Due to the component’s tiny size, well-planned modifications to the paste application and placement processes are necessary to achieve success.
In addition to placement, Suntron has the expertise and dedicated resources, including a state-of-the-art imaging machine, to inspect the printed circuit boards (PCB) and detect defects. While some manufacturers are reluctant to take on the upfront cost of purchasing new equipment, Suntron believes that it is necessary to ensure product quality.
“You can place 01005s and 8 mil pitched micro BGAs without the most current equipment,” explains Bill Dampier, Senior Manufacturing & Process Engineer at Suntron. “But unless you have a machine that will give you a visual of the castellation joint on one of those 01005s, or an x-ray machine that will zoom in on that micro BGA joint so you can confirm what you’ve done, you can’t be sure of the product quality.”
To complement its extensive inspection process, Suntron is ISO 13485 certified and FDA registered and offers manufacturing facilities that meet the strict quality demands of the FDA’s Good Manufacturing Practice (cGMP) standards, defined by FDA 21 CFR Part 820 QSR. Suntron also offers clean rooms in all of its facilities for assuring clean assembly processing and packaging critical clean products.