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Chemically Resistant Epoxy Withstands a Year in Sulfuric & Hydrochloric Acid

March 2, 2011 6:22 am | Master Bond, Inc. | Product Releases | Comments

For applications demanding exceptional chemical resistance, Master Bond has developed EP21AR. Whether coating, lining, bonding, or sealing, this two-component epoxy can withstand harsh, acidic environments...

LISTED UNDER: Epoxy

Silver Conductive Epoxy Meets NASA Low Outgassing Standards

February 24, 2011 6:10 am | Master Bond, Inc. | Product Releases | Comments

Master Bond EP21TDCS-LO electrically conductive silver-filled epoxy cures at room temperature in 24-48 hours and in just one to two hours at 200°F, producing tough high strength bonds.

LISTED UNDER: Epoxy

Thermally Conductive Epoxy Delivers High Temperature Resistance

December 15, 2010 6:29 am | Master Bond, Inc. | Product Releases | Comments

Master Bond has developed a highly thermally conductive epoxy system that is specially designed to help mitigate the issues associated with tightly packed components and miniaturized electronic circuits.

LISTED UNDER: Epoxy
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Epoxy Adhesive Is Cryogenically Serviceable

November 12, 2010 6:17 am | Master Bond, Inc. | Product Releases | Comments

Master Bond's EP21TDCHT-LO two part epoxy adhesive/sealant is specially formulated for demanding applications where factors like temperature cycling, high vibration, and mechanical shock are an issue.

LISTED UNDER: Epoxy

Thermally Stable Epoxy Offers Ultra-Fast Curing

October 4, 2010 5:49 am | Master Bond, Inc. | Product Releases | Comments

Master Bond EP65HT-1 combines high temperature resistance and fast room temperature curing in a NASA low outgassing approved epoxy. It also offers superior electrical insulation capabilities and strong chemical resistance.

LISTED UNDER: Epoxy

Epoxy Combines High Strength and Toughness With Chemical and Abrasion Resistance

September 8, 2010 6:33 am | Master Bond, Inc. | Product Releases | Comments

Combining the benefits of epoxy resins and polyurethanes, Master Bond Polymer System EP30D-7 offers superior strength, flexibility, abrasion resistance, and toughness.

LISTED UNDER: Epoxy | Casting

Thermally Conductive Epoxy Features Cryogenic Serviceability

August 16, 2010 7:37 am | Master Bond, Inc. | Product Releases | Comments

Master Bond EP30FLAO is a two component epoxy resin system for high performance potting, bonding, sealing, and coating. It is extremely versatile and can be used in a wide variety of cryogenic applications.

LISTED UNDER: Epoxy

Heat Resistant Epoxy Adhesive Developed for High Performance Structural Bonding

July 14, 2010 8:06 am | Master Bond, Inc. | Product Releases | Comments

Master Bond Polymer Supreme 46HT-2 was developed for outstanding, high performance bonding strength to both similar and dissimilar substrates.

LISTED UNDER: Epoxy
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Epoxy Packaging Is Well Suited for Small Applications

July 8, 2010 6:04 am | Adhesive Packaging Specialties, Inc. | Product Releases | Comments

Packaging for reactive adhesives, sealants, or resins in small two-part epoxy delivery systems requires only a minimal amount of material to be dispensed at one time.

LISTED UNDER: Epoxy

One Part High Strength Epoxy Has High Thermal Conductivity

June 14, 2010 6:31 am | Master Bond, Inc. | Product Releases | Comments

Master Bond Polymer Adhesive Supreme 10AOHT-LO is a single component, no mix, thermally conductive compound featuring superior electrical insulation and toughness.

LISTED UNDER: Epoxy

Epoxy Has Outstanding Electrical Properties and Chemical Resistance

June 3, 2010 6:35 am | Master Bond, Inc. | Product Releases | Comments

Master Bond EP17HT-3 is a one-part epoxy that sets up in 20 to 30 seconds and snap cures in only two to three minutes.

LISTED UNDER: Epoxy

Epoxy System Ideal for Casting, Bonding, and Sealing

April 6, 2010 5:08 am | Master Bond, Inc. | Product Releases | Comments

This two part epoxy resin system that features low to moderate viscosity is well suited for potting, coating, and sealing electronic assemblies. It excels at bonding dissimilar substrates with different coefficients of expansion and has a wide service temperature range of -60ºF to 250ºF.

LISTED UNDER: Epoxy | Epoxy | Seals and Gaskets

No-Drip Medical Adhesive Designed for Bonding Vertical Surfaces

December 2, 2009 4:28 am | Master Bond, Inc. | Product Releases | Comments

The EP42HT 2 ND 2 has a paste like consistency and facilitates the adhesive's application when bonding vertical surfaces. This no-run two part epoxy fully complies with the testing requirements for USP Class VI biocompatibility.

LISTED UNDER: Epoxy | Biocompatibility Testing | Microbiology/Chemical Testing

Halogen-Free Adhesives for Assembly of Handheld Electronics

April 1, 2009 10:53 am | Product Releases | Comments

In response to industry initiatives and legislation designed to protect the environment from halogenated materials, a line of Loctite adhesives and sealants are offered that meet the requirements of IPC IEC #61249-2-21.

LISTED UNDER: Epoxy | Silicone

USP Class VI Approved Medical Adhesive Has Quick Set Time

December 5, 2008 7:04 am | Master Bond, Inc. | Product Releases | Comments

This low viscosity medical epoxy—EP41SMED—has a handling time of as little as 10-15 minutes and forms resistant bonds to cold sterilants such as EtO and gamma radiation as well as water, oil, and many organic solvents.

LISTED UNDER: Epoxy | Biocompatibility Testing

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