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Liners

Wafer Processing Adhesive

March 20, 2015 9:39 am | by AI Technology, Inc. (AIT) | Product Releases | Comments

Temporary wafer bonding for thin wafer processing is one of the key technologies for wafer level 3D system integration. AI Technology, Inc (AIT) is proud to be the first known provider of a film format high temperature temporary bonding adhesive for thin wafer processing of bonding device...

LISTED UNDER: Films | Liners | Pressure Sensitive
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