Hybrid Circuits

New Solder Paste Technology

February 6, 2014 5:32 pm | by MDT Staff | Product Releases | Comments

Indium Corporation has announced a new solder paste technology. BiAgX is a high-melting lead-free (Pb-free) solder paste technology designed for high reliability electronics assembly applications. Designed as a drop-in replacement for standard high Pb-containing solder pastes, it has passed MSL1 and thermal cycle testing at several power semiconductor customers...

LISTED UNDER: Flexible Circuits | Hybrid Circuits | Integrated Circuits
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