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Operator Interface Products

Gap Filler Ideal for Thermal Interface Applications

September 10, 2008 8:33 am | Product Releases | Comments

The T-flex 700 has been designed for use as a thermal interface material. The product improves the line by increasing the thermal conductivity to 5.0 W/mK.

LISTED UNDER: Operator Interface Products | Die Cutting

High-Performance Gel Provides Low Thermal Resistance

September 10, 2008 8:33 am | Fujipoly America Corp. | Product Releases | Comments

Revitalized interest in high performance interface gel compounds has prompted a re-manufacture and restock of the once discontinued product-Sarcon XR-e material.

LISTED UNDER: Operator Interface Products | Silicone
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