Operator Interface Products
Gap Filler Ideal for Thermal Interface Applications
September 10, 2008 8:33 am | Product Releases | CommentsThe T-flex 700 has been designed for use as a thermal interface material. The product improves the line by increasing the thermal conductivity to 5.0 W/mK.
LISTED UNDER: Operator Interface Products
High-Performance Gel Provides Low Thermal Resistance
September 10, 2008 8:33 am | Fujipoly America Corp. | Product Releases | CommentsRevitalized interest in high performance interface gel compounds has prompted a re-manufacture and restock of the once discontinued product-Sarcon XR-e material.
LISTED UNDER: Operator Interface Products | SiliconeAdvertisement
