Chip Carriers

Heat Sinks

March 9, 2006 12:10 pm | Product Releases | Comments

MaxiFlow heat sinks are designed for cooling BGAs and other hot components in the restricted air flow conditions typical of today’s condensed electronic packages. The heat sinks feature a low profile, spread fin array that maximizes surface area for more effective convection (air) cooling.

LISTED UNDER: Chip Carriers

Chip Inductors

August 11, 2005 8:20 am | Product Releases | Comments

This series of micro-miniature chip inductors are designed to provide extremely tight inductance tolerance with highly stable performance for applications where allowable deviation is critical. Featuring a miniaturized size of just 1.0 x 0.5 x 0.35 mm (Model PM0402T) and 1.6 x 0.8 x 0.

LISTED UNDER: Chip Carriers
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