Sockets
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Fine Pitch BGA Socket Adapter System
Ball Grid Array (BGA) Socket Adapter Systems are an economical solution for device validation and...
Compact Filtered Inlet for Equipment Used in High Temperature Environments
January 9, 2013 10:24 am | by MDT Staff | Schurter, Inc. | Product Releases | CommentsSCHURTER is pleased to announce its new C22F appliance inlet with filter for use in equipment requiring electrical components rated for high ambient temperatures. The unique design provides higher temperature ratings in a standard compact package...
LISTED UNDER: Plugs and Receptacles | SocketsMouser Launches two New Sites focused on the Newest Products and Applications & Technologies
October 4, 2012 11:10 am | by Mouser Electronics | News | CommentsMouser Electronics, Inc., a leading design engineering resource and global distributor for semiconductors and electronic components, announced the launch of its Newest Products and Applications & Technologies sites on Mouser.com. The Newest Products site highlights one of Mouser’s major strengths...
LISTED UNDER: EMI/RFI Filters | EMI/RFI Shielding | Plugs and Receptacles
Extreme Temperature Socket with Superior Electrical Performance from Ironwood Electroincs
July 24, 2012 10:08 am | Ironwood Electronics, Inc. | Product Releases | CommentsIronwood Electronics recently introduced a new QFN socket addressing high performance requirements for 0.5mm pitch devices - SBT-QFN-4016. The contactor is a stamped spring pin with 31 gram actuation force per pin and cycle life of 500,000 insertions. The self inductance of the contactor is 0.88 nH, insertion loss of < 1 dB at 15.7 GHz and capacitance 0.097pF. The current capacity of each contactor is 4 amps. Socket temperature range is -55C to +180C. Socket also features an IC guide for precise QFN edge alignment.
LISTED UNDER: Sockets
Soldercup Header and Socket Interconnects
May 4, 2012 12:06 pm | Product Releases | CommentsMill-Max is expanding its line of wire termination interconnects with new socket and header strips rated at 4.5 amps per contact. These connectors feature pins and receptacles with soldercups...
LISTED UNDER: Sockets | Cable Assemblies | Wire and Cable
Triple Row Header Strips and Triple Row Solder Tail Socket Strips
April 25, 2011 5:13 am | Product Releases | CommentsThe Mill-Max 804 and 805 series interconnects are ideal for high pin count I/O and board-to-board applications. The triple row pin field allows for signal connections to be more densely packaged.
LISTED UNDER: Sockets
Terminal Block Expansion Includes New Plug and Socket Configurations
November 16, 2010 5:53 am | Fci | Product Releases | CommentsFCI, a leading developer of connectors and interconnect systems, has expanded its terminal blocks product portfolio with new plug and socket configurations.
LISTED UNDER: Caps and Plugs | Plugs and Receptacles | Sockets
Elastomer Socket for ICs Uses Small Footprint
November 15, 2010 6:50 am | Ironwood Electronics, Inc. | Product Releases | CommentsThe SG-QFE-7007 socket is designed for 16- x 16- x 1.2-mm package size with 18- x 18-mm lead tip to tip and operates at bandwidths up to 10 GHz with less than 1 dB of insertion loss.
LISTED UNDER: Elastomers | Sockets
Elastomer Socket Offers Superior Electrical Performance
October 25, 2010 6:43 am | Ironwood Electronics, Inc. | Product Releases | CommentsThe SG-BGA-7188 socket is designed for 2.75 x 2.75-mm package size and operates at bandwidths up to 10 GHz with less than 1 dB of insertion loss. The contact resistance is typically 20 milliohms per I/O.
LISTED UNDER: Elastomers | Sockets
Socket Enables Testing of Serial to Parallel Data Convertor
August 26, 2010 8:00 am | Ironwood Electronics, Inc. | Product Releases | CommentsIronwood Electronics recently introduced a new stamped spring pin socket addressing high performance requirements for testing UART serial to parallel data convertor, CBT-QFN-7002.
LISTED UNDER: Sockets
Replacement Leads Feature DIN Overmolded DIN Sockets
August 20, 2010 6:45 am | Bioconnect | Product Releases | CommentsBioconnect’s replacement leads feature DIN overmolded DIN sockets that have a positive fit with any brand of AAMI approved cables.
LISTED UNDER: Sockets | Wire and Cable
BGA Socket Intended for High Speed Probing
June 17, 2010 6:17 am | Ironwood Electronics, Inc. | Product Releases | CommentsIronwood Electronics has recently introduced a new high performance BGA socket for high speed probing of the memory chip and debugging of the system during the design phase.
LISTED UNDER: Sockets
High Performance BGA Socket for 0.4-mm Pitch BGA 400 Pin ICs
May 24, 2010 6:20 am | Ironwood Electronics, Inc. | Product Releases | CommentsIronwood Electronics offers a high performance BGA socket for 0.4mm pitch BGA 400 pin ICs. The CG-BGA-5009 socket is designed for 8.0 X 8.0 mm package size and operates at bandwidths up to 10 GHz with less than 1dB of insertion loss.
LISTED UNDER: Sockets
Sockets Offer Performance-Efficiency
April 6, 2010 5:08 am | Ironwood Electronics, Inc. | Product Releases | CommentsA high performance Universal BGA socket for 0.8-mm pitch DDR2 and DDR3 packages comes with many IC size variations ranging from 7.5 to 15.5 mm. The SG-BGA-6292 socket is designed to accommodate any of those package sizes and operates at bandwidths up to 8 GHz, with less than 1 dB of insertion loss.
LISTED UNDER: Sockets | Sockets
Microelectronics Exposed Using 500K Insertion Socket with Superior Electrical Performance
July 14, 2009 10:56 am | Ironwood Electronics, Inc. | Product Releases | CommentsThe new high performance socket SS-QFE128SD-01 for the Exposed-TQFP128 IC is a spring pin (pogo) with a 20 gram actuation force per ball and cycle life of 500,000 insertions. The self inductance of the contactor is 1.1 nH, insertion loss of 1 dB at 11.5 GHz (3dB at 19.3GHz), and capacitance 0.58pF.
LISTED UNDER: Sockets
Probe Test Socket for Devices up to 13 mm sq.
June 26, 2008 5:11 am | Product Releases | CommentsThe sockets come available in four versions, including 1-3 GHz, 3-5 GHz, 5-9 GHz, and 10-18 GHz, the new socket is ideal for manual, high-speed testing of devices such as CSP, μBGA, DSP, LGA, SRAM, DRAM, and Flash, with pitches as low as 0.4 mm.
LISTED UNDER: Sockets | Component Testing
