Heat Exchangers
Form-in-Place Thermal Compound
March 5, 2013 10:32 am | by MDT Staff | Fujipoly America Corp. | Product Releases | CommentsFujipoly announces the introduction of SARCON® SPG-20A, an easy to dispense, low-viscosity thermally conductive silicone compound. When applied between a heat-generating component and a nearby heat sink or spreader, the very low compression, form-in-place material completely fills all unwanted gaps up to 3.0 mm in height.
LISTED UNDER: Heat Exchangers | Silicone
Heat Sinks for LED Modules
February 7, 2013 4:55 pm | by MDT Staff | Product Releases | CommentsOhmite Manufacturing, a leading provider of thermal solutions and resistors for high current, high voltage and high energy applications, introduces a new line of heat sinks for single LED power modules.
LISTED UNDER: Lamps and Lights | Heat Exchangers
Thermal Gel Sheets
January 30, 2013 10:16 am | Fujipoly America Corp. | Product Releases | CommentsFujipoly announces the availability of Sarcon® 50GR-Ae, an extremely soft 0.5-mm thick thermal interface material. The gel-like sheet compound is designed to efficiently transfer heat from its source to a nearby heat sink.
LISTED UNDER: Heat Exchangers | Silicone
Breakthrough Thermal Technology
December 6, 2012 9:30 am | Thermacore, Inc. | Product Releases | CommentsThermacore, Inc., a leading provider of advanced thermal solutions, is offering a new generation of compact, custom-built, high-performance air-cooled heat sinks, the result of a multimillion-dollar development contract...
LISTED UNDER: Heat Exchangers
Thin-Film Thermoelectric Modules Offer Higher Cooling Capacity
November 14, 2012 10:09 am | Nextreme Thermal Solutions | Product Releases | CommentsNextreme Thermal Solutions, the leader in micro-scale thermal management and power generation solutions, today announced a new series of thin-film thermoelectric modules that offer higher cooling capacity...
LISTED UNDER: Heat ExchangersVersatile Low Hardness Sarcon Thin Film
September 25, 2012 11:29 am | Fujipoly America Corp. | Product Releases | CommentsSarcon 30QR from Fujipoly is a low hardness thermal interface material that exhibits a thermal conductivity of 1.10 W/m°K and a thermal resistance of .57 °Cin2/W. This material is available in roll or sheet form and can easily be die-cut...
LISTED UNDER: Heat Exchangers
Free Design Guide for Electrical Insulation Material
January 22, 2010 10:58 am | Product Releases | CommentsITW Formex has published the 5th Edition of its engineering design and specification guide that provides practical information to engineers, designers, and technical staff specifying electrical insulation and flame retardant materials.
LISTED UNDER: Heat ExchangersPin Fin Heat Sinks: A Sharper Way to Keep Medical Electronics Cool
October 5, 2009 6:19 am | by Barry Dagan | Articles | CommentsKeeping electronics cool is critical to ensuring their long life and reliability. Utilizing heat sinks can help achieve this, but determining the proper type and configuration can be a challenge. This article reviews pin fin heat sinks, material options, sparse vs.
LISTED UNDER: Heat Exchangers | Electronic Components
Splayed Pin Fin Heat Sink
August 31, 2005 8:56 am | Cool Innovations, Inc. | Product Releases | CommentsThe UltraCool P line of splayed pin fin heat sinks generates a cooling premium of 20 to 30 percent over standard pin fin heat sinks, when operating in low air speed environments and in the natural convection mode. The pin fins feature an array of round pins that are splayed outwards.
LISTED UNDER: Heat Exchangers
