Advertisement
Heat Exchangers

Compressible Phase Change Thermal Interface Pad

June 17, 2014 9:56 pm | by MDT Staff | Product Releases | Comments

AI Technology has introduced COOL-GUMPAD CGP7156, a new class of thermal interface material with extreme compressibility to fill in all uneven and unparallel thermal interface surfaces in LED luminaire modules...

LISTED UNDER: Heat Exchangers
Advertisement

Easy Handling Thermal Compound

June 4, 2014 6:08 pm | by MDT Staff | Fujipoly America Corp. | Product Releases | Comments

SARCON SPG-30A from Fujipoly is an ideal thermal interface option for circuit boards with a large surface area, many components and delicate solder points...

LISTED UNDER: Heat Exchangers | Silicone

Heat Sinks

April 21, 2014 9:48 am | by MDT Staff | Product Releases | Comments

Crydom, a brand of Custom Sensors & Technologies (CST), announces the availability of 4 new Heat Sinks designed specifically for use with single, dual and 3-phase Solid State Relays. The new models, rated at 0.25, 0.36. 0.7, and 1.0 degrees C...

LISTED UNDER: Heat Exchangers

Thermal Interface Material

April 21, 2014 9:38 am | by MDT Staff | Product Releases | Comments

AI Technology, Inc. (AIT) introduces COOL-PAD CPR7154, a new class of thermal interface material that dispenses like a thermal pad, but performs with characteristics like that of a grease or gel when device temperatures increase to above 45°C...

LISTED UNDER: Heat Exchangers

New Low Resistance TIM Delivers 6.0 W/m°K Performance

September 18, 2013 3:50 pm | by MDT Staff | Fujipoly America Corp. | Product Releases | Comments

Fujipoly has announced the introduction of Sarcon GR45A-00 a very low modulus thermal interface material with a low thermal resistance. This new formulation completely fills air gaps between components, board protrusions and recessed areas while exhibiting very low pressure.

LISTED UNDER: Heat Exchangers

Thermal Gel Sheets: A Cooling Influence on LED Lighting

August 12, 2013 3:06 pm | by MDT Staff | Fujipoly America Corp. | Product Releases | Comments

Over the last several years hundreds of major electronics manufacturers have expanded their use of LED lighting to enhance both product appearance and functionality. Recent design trends have integrated LED lighting packages in thousands of consumer and industrial electronic platforms...

LISTED UNDER: Lamps and Lights | Heat Exchangers

Form-in-Place Thermal Compound

March 5, 2013 10:32 am | by MDT Staff | Fujipoly America Corp. | Product Releases | Comments

Fujipoly announces the introduction of SARCON® SPG-20A, an easy to dispense, low-viscosity thermally conductive silicone compound. When applied between a heat-generating component and a nearby heat sink or spreader, the very low compression, form-in-place material completely fills all unwanted gaps up to 3.0 mm in height.

LISTED UNDER: Heat Exchangers | Silicone

Heat Sinks for LED Modules

February 7, 2013 4:55 pm | by MDT Staff | Product Releases | Comments

Ohmite Manufacturing, a leading provider of thermal solutions and resistors for high current, high voltage and high energy applications, introduces a new line of heat sinks for single LED power modules.

LISTED UNDER: Lamps and Lights | Heat Exchangers

Thermal Gel Sheets

January 30, 2013 10:16 am | Fujipoly America Corp. | Product Releases | Comments

Fujipoly announces the availability of Sarcon® 50GR-Ae, an extremely soft 0.5-mm thick thermal interface material. The gel-like sheet compound is designed to efficiently transfer heat from its source to a nearby heat sink.

LISTED UNDER: Heat Exchangers | Silicone

Breakthrough Thermal Technology

December 6, 2012 9:30 am | Thermacore, Inc. | Product Releases | Comments

Thermacore, Inc., a leading provider of advanced thermal solutions, is offering a new generation of compact, custom-built, high-performance air-cooled heat sinks, the result of a multimillion-dollar development contract...

LISTED UNDER: Heat Exchangers

Thin-Film Thermoelectric Modules Offer Higher Cooling Capacity

November 14, 2012 10:09 am | Nextreme Thermal Solutions | Product Releases | Comments

Nextreme Thermal Solutions, the leader in micro-scale thermal management and power generation solutions, today announced a new series of thin-film thermoelectric modules that offer higher cooling capacity...

LISTED UNDER: Heat Exchangers

Versatile Low Hardness Sarcon Thin Film

September 25, 2012 11:29 am | Fujipoly America Corp. | Product Releases | Comments

Sarcon 30QR from Fujipoly is a low hardness thermal interface material that exhibits a thermal conductivity of 1.10 W/m°K and a thermal resistance of .57 °Cin2/W. This material is available in roll or sheet form and can easily be die-cut...

LISTED UNDER: Heat Exchangers

Free Design Guide for Electrical Insulation Material

January 22, 2010 10:58 am | Product Releases | Comments

ITW Formex has published the 5th Edition of its engineering design and specification guide that provides practical information to engineers, designers, and technical staff specifying electrical insulation and flame retardant materials.

LISTED UNDER: Heat Exchangers

Splayed Pin Fin Heat Sink

August 31, 2005 8:56 am | Cool Innovations, Inc. | Product Releases | Comments

The UltraCool P line of splayed pin fin heat sinks generates a cooling premium of 20 to 30 percent over standard pin fin heat sinks, when operating in low air speed environments and in the natural convection mode. The pin fins feature an array of round pins that are splayed outwards.

LISTED UNDER: Heat Exchangers
X
You may login with either your assigned username or your e-mail address.
The password field is case sensitive.
Loading