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Film Adhesive

Thu, 07/08/2004 - 11:39am

LISTED UNDER:

A high-performance, electrically conductive, B-staged film adhesive is capable of bonding to gold or gold-plated substrates. E2213F is suited for EMI/RF grounding applications and meets ASTMD 3850 for space simulated outgassing and MIL STD 883 section 3.8.5.1 for TGA outgassing. It is available as a preform or in sheet form up to 12 in. square. The company is a leading manufacturer of epoxy adhesive films and preforms. The epoxies are B-staged thermoplastic or thermosetting materials that are available both supported and unsupported. Other materials utilized include epoxy/urethane, thermoplastic polyester, and polyimide thermosetting resins.
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