Fri, 10/15/2004 - 7:03am
The V300-4GR Microwave Plasma System was designed for cleaning and surface activation of polymer flex circuit materials. It features automated un-wind, plasma treatment, and re-wind of reels up to 267 mm dia. x 48 mm wide. Depending on the level of contamination, cleaning speeds of up to 3 meters per minute are possible. The system can also be configured for automatic removal and re-insertion of protective interface layers. The V180-5GR Gas Plasma System was designed for etching polyimide film. Winding, plasma etching, and re-winding are automated and can accommodate reels up to 400 mm dia. x 70 mm. Etching speeds on polyimide of up to 6 microns per minute are typical.