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Silicone-Free Thermal Interface Material

Mon, 11/06/2006 - 10:37am

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Gore Polarchip SF3000 silicone-free thermal interface material is a truly soft silicone-free thermal gap pad. The absence of silicone eliminates the problems of silicone outgassing and silicone oil migration (“bleeding”), making SF3000 an ideal gap pad for silicone sensitive applications. The material is a fluoropolymer composite that consists of an expanded polytetrafluoroethylene (ePTFE) matrix filled with boron nitride (BN) particles. The low elastic modulus of the ePTFE matrix imparts softness, conformability, and excellent compressibility to the composite, while the high thermal conductivity of the BN particles gives the composite its good thermal transport characteristics.

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