Product Releases

Semiconductor Package

Tue, 05/08/2007 - 11:29am

The CoreEZ semiconductor package utilizes an organic, thin core build-up flip chip technology that combines exceptional electrical performance, wireability, and reliability with a cost sensitive material set. This includes 2x the board level reliability of a standard FC PBGA or FC ceramic BGA, as well as full signal wiring on both sides of the core. CoreEZ provides an excellent cost/performance ratio for users looking to make the jump from ceramic semiconductor packages to flip chip technology. It utilizes particle filled standard epoxy technology without the glass and is extremely thin, with the capability of replacing standard build-up packages.


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