Coreless Semiconductor Package
Fri, 08/10/2007 - 5:14am
HyperBGA is a PTFE-based coreless semiconductor package that enables silicon devices to run at extremely high speeds. The combination of the low loss, low dielectric constant material, and strip line cross sections enables signal speeds surpassing 12 Gb/s. The material compliance of the PTFE, combined with the dimensional stability of a copper-invar-copper center plane, enables HyperBGA to provide long field life, with none of the BGA wear out, die cracking, delamination, or flip chip bump fatigue of other packages.