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Probe Test Socket for Devices up to 13 mm sq.

Thu, 06/26/2008 - 5:11am

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The sockets come available in four versions, including 1-3 GHz, 3-5 GHz, 5-9 GHz, and 10-18 GHz, the new socket is ideal for manual, high-speed testing of devices such as CSP, μBGA, DSP, LGA, SRAM, DRAM, and Flash, with pitches as low as 0.4 mm. The socket’s solderless, pressure-mount, compression spring probes allow the socket to be easily mounted to and removed from the test board. It provides minimal signal loss for higher bandwidth capability via a signal path of only 0.077 inches (1.95 mm). With an overall size of 1.200 inches (30.48 mm) × 0.840 inches (21.34 mm) × 0.440 inches (11.18 mm), the socket provides the maximum allowable space for board components and connectors.
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