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Gap Filler Ideal for Thermal Interface Applications

Wed, 09/10/2008 - 8:33am

The T-flex 700 has been designed for use as a thermal interface material. The product improves the line by increasing the thermal conductivity to 5.0 W/mK. The soft material is highly compliant, allowing for thinner interfaces and overall improved thermal performance as measured by total thermal resistance. Thickness ranges currently available include 0.04? to 0.2? in 0.01? increments. They are available in standard sheets or die cut parts that can be custom made to specification. Another available option is adhesive on one side. The gap filler is RoHS compliant and meets all requirements.


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