Silicone-Free Interface Material Provides High Thermal Conductivity
Wed, 01/14/2009 - 9:25am
Keratherm U 90 thermal interface material is designed for use where contamination concerns prohibit the use of silicone-based thermal pads, but where high levels of thermal conductivity are needed for sufficient thermal transfer in hot electronic devices. U 90 material consists of a ceramic-filled polyurethane film with thermal conductivity of 6.0 W/mK and thermal impedance of just 0.05 Kin2/W. The material has a high voltage breakdown property of 4.0 kV. It provides strong perforation protection with a tensile strength of 2.5 N/mm2 and a Shore A hardness of 70.