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Low-Profile Copper Cable for QSFP Assemblies

Mon, 11/02/2009 - 12:04pm

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Gore Low-Profile Copper Cable fulfills the needs of dense, higher-port-count switch installations while providing a reliable interconnect for high-performance computing (HPC). It was developed for QSFP Assemblies and InfiniBand QDR applications. With a diameter of 0.170” for a 4x channel, 8-pair cable, the cross-section savings is 37% compared to alternative cables from the company and 58% compared to typical industry offerings. This low-profile cable is targeted at high-performance computing applications, where a large percentage of high-density port-count interconnects are 2 meters or less (e.g., in top-of-the-rack switching installations).
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