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Thermal Gap Fillers Combine High Performance, Low Pricing

Tue, 06/29/2010 - 7:29am
Thermal Gap Fillers Combine High Performance, Low PricingTP-S30 thermal interface pads from MH&W International provide 3.0 W/mK of thermal conductivity between hot components and heat sinks at lower costs than competing gap filler materials. Pads of TP-S30 thermal gap fillers are soft and compliant for easy compression and filling of air gaps between mounting surfaces to optimize heat transfer.

Lower pricing is available for TP-S materials with lower thermal conductivities, i.e. 2.0 and 1.0 W/mK (TP-S20 and TP-S10). A low silicone content version, TP-S30LS, has less than 50 parts per million silicone content for applications where silicone-based outgassing can lead to contamination problems or oily silicone residues can hamper assembly.

All TP-S series gap fillers are provided in 210 x 297 mm (8.3 x 11.7 inch) sheets or in standard die cut shapes. Custom shapes are available. Standard materials have a Shore 00 hardness of 45. Standard thicknesses range from 0.5 to 5.0 mm. All materials are UL94 V0 rated and have a use temperature range of -60 to 200°C.

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