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Board Level Shielding Allows Engineers to Isolate Individual Components

Fri, 02/25/2011 - 5:34am
Board Level Shielding Allows Engineers to Isolate Individual ComponentsMarket demand for smaller, lighter, and faster electronics has forced many engineers to search for innovative methods to control unwanted RF interference and reduce weight at the same time. One of the easiest ways to achieve these design objectives is to replace existing milled aluminum circuit board covers, also referred to as hogout shields, with a Leader Tech Multi-Cavity CBS or Slot-Lok product.

The company’s newly expanded lines of multi-cavity board-level shielding allow engineers to isolate individual components on the same board with minimal weight and footprint allocations. In addition to offering up to 60 dB of shielding effectiveness (SE), the shields are quickly installed using through-hole or surface mount soldering. The two-piece fence and removable cover construction also facilitates easy rework and inspection processes.

When compared to similar machined aluminum solutions, Leader Tech Multi-Cavity CBS and Slot-Lok shields dramatically reduce space, weight (up to 25%), assembly cost, and time-to-market.

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