Silver Conductive Epoxy Meets NASA Low Outgassing Standards
The adhesive cures at room temperature in 24-48 hours and in just one to two hours at 200°F, producing tough high strength bonds. It features tensile shear strength of more than 1,800 psi, T-peel of greater than 5 pli, and outstanding adhesion to similar and dissimilar substrates. The volume resistivity of the system is less than 10-3 ohm-cm. Serviceable over the exceptionally wide range of 4 K to 275°F, EP21TDCS-LO is suitable for cryogenic applications. It withstands thermal cycling and is resistant to chemicals, including water, oil, and most organic solvents.
The epoxy offers a simple 1:1 mixing ratio by weight or volume. With its low drip formula, EP21TDCS-LO can be conveniently applied with a syringe, knife, spatula, or trowel to vertical surfaces without sagging and only contact pressure is required for curing. Syringes have a three month shelf life and glass jars have a six month shelf life, if stored at room temperature. EP21TDCS-LO is available in premixed and frozen syringes, as well as in metal containers.