Thermal Gap Filler Material
To help remove performance-killing heat from these types of complex, multi-level printed circuit board designs, Fujipoly has developed Sarcon® GR-SL, an extremely low compression and high-performance thermal gap filler material. When placed on top of uneven components, this material quickly conforms to all gaps, peeks and air pockets making a level, large surface area contact point. The high degree of physical contact allows the heatsink to more efficiently remove unwanted heat.
As Fujipoly’s softest gap filler pad, this unique formulation provides a thermal conductivity of 2.7 W/m°K with a thermal resistance between 0.94 and 1.69 °Cin2/W depending on sheet thickness. The V-0 tested Sarcon® GR-SL is available in 2.5 or 5.0mm thick sheets up to a maximum 200x300mm dimension and has an operating temperature of -40 to +150°C.