Ultrafast Laser Micromachining
JPSA’s experienced laser scientists in the Applications Laboratory have integrated Pico-second laser systems at wavelengths ranging from UV to IR (355nm – 1064nm), to provide precision machining, cutting, and hole drilling, with minimized thermal effects. JPSA Pico-second laser systems provide high peak energy intensity, resulting from the short pulse duration, enabling these lasers to increase coupling with materials that are typically transparent to lasers with longer pulse widths. JPSA’s patent-pending beam delivery technologies significantly enhance the Pico-second laser machining throughputs up to 10 times faster than laser materials processing competitors performing similar applications.
In making the announcement, Jeffrey Sercel, CEO of JPSA said, “We have begun first shipment of our IX-6168 Micromachining System configured with a Pico-second laser and Galvanometer to manufacturing customers. Applications range from cutting, hole-drilling, via-drilling, texturing, thin film removal/patterning, to machining of 3D features. Many applications and materials benefit from the clean Pico-second laser ablation. When combined with JPSA’s patent pending beam delivery technologies, we can maximize throughput and quality to provide our customers the competitive edge.”