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High Energy Picosecond Pulses Enables Machining Thicker Materials

Wed, 09/11/2013 - 4:06pm
MDT Staff

Coherent has expanded their family of industrial ultrafast lasers with the Talisker HE series, whose high energy pulses enable drilling, cutting and scribing of thicker materials than with other ultrafast lasers. Talisker HE lasers are available with a choice of output options; 200 µJ pulse energy in the near-IR (1064 nm), 120 µJ per pulse in the green (532 nm), or 40 µJ pulse energy in the ultraviolet (355 nm). Talisker HE is ideal for high-throughput, precision materials processing in industries such as automotive, biomedical, consumer electronics, mobile display & 3D semiconductor. 

Talisker lasers are a family of industrial picosecond products, well documented to deliver higher quality process finished goods than conventional pulsed lasers or non-laser micromachining methods. Picosecond lasers achieve the quality improvement using a process known as ‘Cold Ablation’, due to negligible unwanted thermal effects. The result is improved process quality with minimized heat affected zone (HAZ) and no unwanted melt debris.

For more information, visit www.Coherent.com.

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