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New Gap Filler Pad Exhibits Thermal Resistance of Only .21°Cin2/W

Mon, 11/04/2013 - 12:11pm
MDT Staff

Fujipoly’s New Sarcon GR25A-0H2-30GY is a 0.3mm thick, low thermal resistance interface material with a low-tac surface on both sides. This special treatment dramatically reduces material tearing and damage during assembly and rework operations. The new formulation improves cooling performance by filling unwanted air gaps between board components and processors thereby increasing surface contact with a heatsink.

Sarcon GR25A-0H2-30GY transfers heat with a thermal conductivity of 2.8 W/m°K per ASTM D2326 and a thermal resistance of .21°Cin2/W at 14.5 PSI (1.33°Ccm2/W at 100Kpa). This flame retardant TIM is available in sheets up to 300mm x 200mm and can be die-cut or trimmed to fit your exact application specifications.

For more information, visit www.fujipoly.com

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