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Compressible Phase Change Thermal Interface Pad

Tue, 06/17/2014 - 9:56pm
MDT Staff

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AI Technology, Inc. (AIT) has introduced COOL-GUMPAD CGP7156, a new class of thermal interface material with extreme compressibility to fill in all uneven and unparallel thermal interface surfaces in LED luminaire modules, large area power modules and large area metal-core printed wiring board (MCPWB) applications.

COOL-GUMPAD CGP7156 dispenses like a thermal pad with immediate high performance. When the module operates and heats to above 45°C, the interface pad (COOL-GUMPAD CGP7156) will melt-flow to provide the lowest thermal interface even in comparison to the best of thermal greases.

For more information, visit www.aitechnology.com.

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