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Easy Handling Thermal Compound

Wed, 06/04/2014 - 6:08pm
MDT Staff

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 The form-in-place silicone compound completely fills all spaces, gaps and protrusions when compressed by a heat sink or spreader. The material’s high viscosity and ultra-low compression force are ideal for applications with gaps ranging from .30mm to 1.0mm.   

Once applied, SARCON SPG-30A delivers a thermal conductivity of 3.2 W/m°K with a thermal resistance of only .3°Cin2/W. The form stable thermal compound requires no heat curing, will not cause corrosion on metal surfaces, and maintains all initial properties across a wide temperature range (-40C to + 150C). Fujipoly’s SARCON® SPG-30A material is available in 30ml tubes, 325ml cartridges. 

For more information, visit www.fujipoly.com.

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