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One Component, Snap Cure Epoxy Features High Strength Properties

Wed, 08/06/2014 - 3:15pm
MDT Staff

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Suitable for a variety of applications in the electronic, aerospace and OEM industries, Master Bond EP3SP5FL is a single component epoxy that cures in 1-2 minutes at 300°F. Since it requires heat curing, it essentially has “unlimited” working life at room temperature.

With a flowable, moderate viscosity, EP3SP5FL adheres well to a variety of substrates including metals, composites, glass, ceramics, many rubbers and plastics. It has a high tensile lap shear strength exceeding 2,000 psi at room temperature when bonding aluminum to aluminum. EP3SP5FL is an effective electrical insulator and it withstands thermal cycling, impact and shock. It also resists water, oils, fuels and has low shrinkage upon curing.

For more information, visit www.masterbond.com.

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