Details about the DesignCon 2013 conference and expo programs were announced today by UBM Tech, the daily source of essential business and technical information for the electronics industry’s decision makers. Scheduled to take place January 28-31 in Santa Clara, Calif., the DesignCon conference program will provide attendees with four full days of intensive technical learning and networking opportunities created by engineers for engineers, and includes 100+ in-depth tutorials, technical paper sessions and panel discussions divided into 14 tracks that address the pervasive nature of signal integrity at all levels of electronic design. Additionally, the DesignCon expo will feature a series of technical and interactive Theater Sessions, as well as to two progressive educational forums staged by host sponsor, Agilent Technologies, two live teardowns, several sponsored training sessions, visionary keynote speakers and 130+ exhibitors – more than any other design engineering event this season – all of which are open to both conference and expo attendees.
“DesignCon has earned its reputation as the premier annual trade event for the semiconductor and electronic design industries by consistently providing engineers with unique opportunities to learn about cutting-edge technical developments and solutions within the chip, board and systems design community,” said Patrick Mannion, Content Director at UBM Tech. “And, with its thorough roster of targeted, in-depth training sessions presented by leading industry experts and an exhibit floor featuring a comprehensive industry presence, DesignCon 2013 will be no exception.”
Designed to introduce attendees to the latest technologies and developments in the industry, the DesignCon expo offers several unique and intensive educational and networking opportunities, including the following Chiphead Theater Sessions and Agilent Educational Forums.