Yole Développement announce the imminent release of its latest research study about Embedded Wafer-Level-Packages, covering the industry status in the commercialization of both Fan-Out WLP and Chip Embedding in Substrate technologies.


Historically, embedded IC package technology is not new at all: several players such as Freescale with its RCP, Infineon with its eWLB and Ibiden for die embedding into PCB laminated substrates have developed dedicated technologies and process IP in this area for years. Benefits of embedded package integration include miniaturization, improvement of electrical and thermal performance, cost reduction and simplification of logistic for OEMs.

“Things are moving really fast at the moment as this year, we see both Fan-out wa-fer level packaging and chip embedding into PCB laminate infrastructures emerging at the same time, ramping to high volume production. “ says J. Baron, Technology & Marketing Analyst at Yole Développement. 

Fan-Out WLP technology is emerging on both 200mm / 300mm infrastructures


Infineon is having a great success with its proprietary eWLB technology: the first FO-WLP wafers are mass produced on 200mm both at Infineon, STATS ChipPAC and ASE since 2009.

Indeed, Fan-Out WLP is extending the general concept of Wafer Scale Packaging to new application categories, especially the ones with higher pin-counts and larger chip size such as wireless communication ICs. First embedded package products based on eWLB have been identified within LGE and Nokia handsets.

This year, a few additional players are even more aggressive in putting further capacity for eWLB manufacturing as both STATS ChipPAC and NANIUM are at the moment ramping-up their facilities for manufacturing the first generation eWLB on 300mm reconfigured wafers. Other packaging houses such as SPIL, Amkor, UTAC, ACET and others are also on the point to announce the start of their own Fan-out wafer level packaging operations.

Embedded die package technology to expand fast from niche to high volume markets


At the same time, embedded die package technology has made a lot of progress on its side. Based on PCB laminate infrastructure, chip embedding technology is actually on the way to catch a relatively important portion of the actual WLCSP pack-aging business as it does leverage the existing WLP/RDL infrastructure already established worldwide: indeed, most of WLCSP die applications are “embedded ready”, so to realize the full benefits of this “WLCSP to Embedded die” conversion, only a few extra manufacturing steps are missing like the realization of thin copper plating process, extreme wafer thinning down to 50μm, thin dies handling and dicing.



Electrical performance, testing and manufacturing yields are still major issues and showstoppers for chip embedding technology to move forward. Therefore, initial volume markets for embedded packages will be rather small, low pin-counts analog type of applications such as integrated passive devices (IPD), RFID and power components that are at the moment under qualification for mass production before the end of this year already.

Generally speaking, Yole Développement believe that the winning situation for embedded die packages can be met for company partnerships able to cross-over the traditional packaging, assembly and test supply chain. A good example would be to put together a leading analog IC player (such as TI, Maxim IC, NXP or ST) with a WLP/RDL partner (such as FCI, Casio Micronics, NEPES, etc…) together with a PCB integrator player (such as Imbera / Daeduck, Ibiden, AT&S, Taiyo Yuden or SEMCO). This type of emerging partnerships are absolutely necessary in order to standardize the embedded package technology and to leverage an entire new packaging infra-structure based on low-cost, panel size PCB manufacturing techniques.