Under support from the Ministry of Economic Affairs (MOEA), ITRI revealed plans to pour NT$1.6 billion (US$49.75 million) into its development project for 3D IC technology over the next four years. ITRI will also set up an R&D team of 150 engineers to specialize in integrated services from design to manufacturing to testing and packaging.
In addition to equipment partners Applied Materials and Suss MicroTec, ITRI said it is also working with members of the Advanced Stacked-System Technology and Application Consortium (Ad-STAC) to jointly accelerate the development and commercialization of 3D chip technology.
The ITRI-led Ad-STAC now consists of 19 multinational companies including Advanced Semiconductor Engineering (ASE), Cadence, Sumitomo Precision Products (SPP) and United Microelectronics Corporation (UMC).
Using TSV in a package that stacks ICs in a 3D structure can reduce the length of conducting wires and the chip size, a technology promising to replace conventional SoC or SiP solutions that integrate ICs on a 2D surface.
Fig 1: ITRI experimental lab for 3D IC technology, photo ITRI