The Workshop will present improvements in thermal management materials, components and systems, to provide

innovative packaging and cooling solutions for highly integrated power, RF, microwave and other devices and subsystems.

Increases in functionality, complexity, miniaturisation, operating temperature and power output will require advances

in thermal solutions at many levels, for military, aerospace, consumer and industrial systems.

Industry transition to SiC and GaN devices allows higher operating temperatures with higher heat flux but also

greater reliability; these trends also require improvements and changes in packaging and thermal materials.

Thermal management has been clearly identified, in industry technology roadmaps worldwide, as a crucial constraint

in packaging at all levels.

To download the Advanced Program, please click here.

To download the Registration form, please click here.

Pay attention to the deadlines:

Early Registration ends January 15, 2011

Final Registration ends on January 25, 2011 

For more information, please contact INTERCONEX France:

Florence Vireton 49 rue Lamartine 78035 Versailles France

tél. : +33 (0) 1 39 67 17 73/ fax : +33 (0) 1 39 02 71 93

e-mail :

Web site: