The Workshop will present improvements in thermal management materials, components and systems, to provide
innovative packaging and cooling solutions for highly integrated power, RF, microwave and other devices and subsystems.
Increases in functionality, complexity, miniaturisation, operating temperature and power output will require advances
in thermal solutions at many levels, for military, aerospace, consumer and industrial systems.
Industry transition to SiC and GaN devices allows higher operating temperatures with higher heat flux but also
greater reliability; these trends also require improvements and changes in packaging and thermal materials.
Thermal management has been clearly identified, in industry technology roadmaps worldwide, as a crucial constraint
in packaging at all levels.
To download the Advanced Program, please click here.
To download the Registration form, please click here.
Pay attention to the deadlines:
Early Registration ends January 15, 2011
For more information, please contact INTERCONEX France:
tél. : +33 (0) 1 39 67 17 73/ fax : +33 (0) 1 39 02 71 93
e-mail : email@example.com
Web site: www.imapsfrance.org