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Cascade Microtech, Inc. (NASDAQ: CSCD), a leading expert at enabling precision measurements of integrated circuits at the wafer level, and the nanoelectronics research center imec, today announced they have entered into a collaborative research partnership for testing and characterization of 3D integrated circuit (IC) test structures. Imec will work closely with Cascade Microtech to develop test methods and methodologies for emerging 3D Through-Silicon-Via (TSV) structures, and to lead the way in development of global standards for 3D IC development and production test.

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