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SOURCE [1]

Content Item Type: 
News [2]
Meta Canonical URL: 
http://www.mdtmag.com/news/2010/08/insights-suss-workshop-thin-wafer-handling-semiconwest-2010
Summary: 
At the recent Semicon exhibition in San Francisco Suss assembled a group of partners and technical and market experts (shown below) to discuss the status of 3D IC and specifically temporary bonding and thin wafer handling.
Contributed Author: 
I-Micronews
Legacy NID: 
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